SMD-3D Profiling System

FEATURE: 3D Profiling
and Inspection


Customer List

The AV650 can import prober data, eliminating the need to ink mark on the prober itself, increasing prober utilization.  By combining the ink marking between the prober and the inspection station a complete wafer map is generated at the end of the inspection routine.

Semiautomatic Inspection Software:

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The software offers the user a variety of alternatives to inspect the wafer.  The software is Windows NT based with an interactive menu scheme for easy access to all the functions.  The first and simplest mode of opperation is the manual mode.  By using the keyboard arrow keys or mouse the operator can manually jog around the part and decide whether the die is good or bad.

The second mode of operation is the sepentine scan mode.  The operator pre-programs a complex inspection pattern for a single die, then the pattern is step and repeated over the entire wafer.  All defect data is stored in ASCII files by Wafer Type and Serial Number for subsequent SPC processing.  Upon completion of the inspection process a complete wafer map can be generated.  This wafer map data can be used to drive subsequent processes such as pick and place.

The system comes standard with user definable defect codes which can be instantly assigned to defect locations during the inspection process via "Hot Keys".  In a defect file, the system stores defect type, X and Y location, die indentification, Type/Serial numbers, and automatically date stamps the file upon completion of inspection routine.  The system can be configured to prints the defect report and/or a defect map directly to a systen printer upon completion.

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