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The AV650 Series Inspection Systems provide semiautomatic inspection capability for a wide variety of electronic assemblies. The model AV650S is designed to inspect semiconductor wafers and individual dies.
The AV650S provides the operator with both a top and bottom view of the wafer simultaneously. Using programmable zoom optics the operator can view a matrix of die or zoom in and inspect a single die at a time. A program is set up to take the operator methodically through inspection of the entire wafer. During the inspection process the operator is allowed to suspend the inspection routine and log defects. Bad die locations are stored along with a corresponding defect code. Upon completion of the inspection process bad dies are precisely, automatically marked so that neighboring dies are not compromised.
Defect data is stored by part and lot number. It is possible to recall defect files and verify only defective areas on any given wafer previously inspected. Defect Data can be printed out in one of two ways, either an ASCII printout or a Defect Map of the wafer. Since the data is stored in an ASCII based file it is easy to import defect data into various SPC programs for subsequent processing.
Since all defective locations are stored by part and lot number in a database it is possible to pass that information directly to the pick and place operation and work directly from the wafer and bypass the step of die placement into a waffle pack.
The software is user friendly and Windows based. An entry level operator can easily program and operate the system with only a few hours of training.
In Summary, the AV650S provides an ergonomic, cost effective approach to the inspection of wafers, the result a highly reliable and efficient inspection process.
Mechanical Structure:
The AV650S is configured with a precisely aligned, dual optical, imaging system. One set of optics is positioned over the top of the wafer while the other views the wafer from the bottom side. Both views are perpendicular and displayed simultaneously on two 13", high resolution, S-VHS Monitors.
The wafer is fixtured on a computer controlled X, Y table. The ring mount fixture has the ability to precisely rotate for registration of the wafer. The tooling fixture sits on the open frame X, Y table. Both axes are lead screw driven. DC Brushless Servo motors are used to drive the motion system. Rotary encoders are used to feedback position information to the CPU. The system can accommodate up to a 10" wafer.
Imaging System:
The inspection system can provide a variety of magnifications depending on the objective lens used. The zoom ratio is constant at 6.5:1. A small 2" fiber optic ring light is used on each set of optics. Each optical system has independent intensity control.
Software:
Programming entails, defining a fiducial location (0,0), defining diagonal corners of the inspection area, defining X and Y step size between die or matrix of die. Given that information a program is automatically generated.
Once in the inspection mode the operator interfaces with the system via the mouse. The program will sequentially inspect each die in the matrix. When a defect is detected the system is halted, a defect is logged and the inspection sequence continues. Defect categories can be configured by the user to meet their companies nomenclature. There is no limitation to the number of points defined within the inspection program.
The operator can review defect files and print out defect reports. The defect data is stored on hard disk in an ASCII format until such time that the system is purged of the data. Data is stored by part and lot number.
Computer:
The computer system will be configured as follows:
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